The global electronics manufacturing industry is undergoing rapid transformation. The increasing complexity of devices, shrinking component sizes, and the rise of smart and connected systems are placing unprecedented demands on production workflows. Printed circuit boards, the backbone of modern electronics, are at the center of this shift. Manufacturers must deliver high reliability while adapting to environmental regulations, supply chain pressures, and the integration of advanced digital technologies.
To better understand these evolving dynamics, we spoke with Harshitkumar Ghelani, an electronics engineer and Production Manager with deep expertise in high-reliability PCB manufacturing, process engineering, quality assurance, and end-to-end production management. With hands-on experience across the full PCB fabrication cycle—including material planning, layer scaling, imaging, drilling, lamination, plating, AOI inspection at every layer, surface finishing, and final testing—he has led complex manufacturing projects involving 16- and 20-layer hybrid boards with multiple lamination cycles and over 37 controlled process steps.
Harshitkumar has a strong track record in process optimization and root cause analysis In addition to his operational leadership, he brings research depth to manufacturing practice, with multiple published research papers focused on Six Sigma, additive manufacturing in electronics, and AI-driven quality control. His combined expertise in production leadership, laboratory testing, equipment calibration systems, and continuous improvement makes him a recognized voice in advancing reliable, high-layer PCB manufacturing in modern electronics industries.